Personal tools

Home » Additive Manufacturing for Microwave Components

Additive Manufacturing for Microwave Components

Bing ZHANG, Ph.D. ProfessorBing Zhang received the B.E. from the Civil Aviation University of China 2004, the M.E. from Shanxi University 2008, and the Ph.D. degree from Nanyang Technological University 2012, in Electrical and Electronic Engineering. He was a Visiting Scholar with the University of Nice Sophia Antipolis, Nice, France, in May 2012, and a Visiting Scientist with Télécom Bretagne, Brest, France, in November 2014 and April 2015.

He was a Post-Doctoral Researcher with the Microwave Electronics Laboratory, Department of Microtechnology and Nanoscience, Chalmers University of Technology, Gothenburg, Sweden, from November 2012 to October 2015. He was a Research Fellow with Department of Electrical and Computer Engineering, National University of Singapore from 2016-2017. He has been a Full Professor with the College of Electronics and Information Engineering, Sichuan University since 2017. His current research interests include design and co-design of RF passive and active devices, mm Wave and THz antennas, packaging of mmWave and THz devices, and 3-D printing technologies for millimeter-wave and THz applications.


Raj Mittra Raj Mittra is a Professor in the Department of Electrical Engineering & Computer Science department of the University of Central Florida in Orlando, FL., where he is the Director of the Electromagnetic Communication Laboratory. Prior to joining the University of Central Florida, he worked at Penn State as a Professor in the Electrical and Computer Engineering from 1996 through June, 2015. He was a Professor in the Electrical and Computer Engineering at the University of Illinois in Urbana Champaign from 1957 through 1996, when he moved to the Penn State University. Currently, he also holds the position of Hi-Ci Professor at King Abdulaziz University in Saudi Arabia.

He is a Life Fellow of the IEEE, a Past-President of AP-S, and he has served as the Editor of the Transactions of the Antennas and Propagation Society. He won the Guggenheim Fellowship Award in 1965, the IEEE Centennial Medal in 1984, and the IEEE Millennium medal in 2000. Other honors include the IEEE/AP-S Distinguished Achievement Award in 2002, the Chen-To Tai Education Award in 2004 and the IEEE Electromagnetics Award in 2006, and the IEEE James H. Mulligan Award in 2011.

Recently he founded the e-Journal FERMAT ( and has been serving as the co-editor-in-chief of the same. Dr. Mittra is a Principal Scientist and President of RM Associates, a consulting company founded in 1980, which provides services to industrial and governmental organizations, both in the U.S. and abroad.



The Additive Manufacturing (AM) technology, which offers numerous advantages over the traditional fabrication technologies, is currently being extensively explored for the fabrication of microwave components. Using AM to fabricate microwave devices not only requires knowledge and experience in microwave engineering, but also in related subjects such as material science. The emerging of the AM for microwave engineering also coincides with the ‘industry 4.0’. The AM technology can be considered a breakthrough for the development of RF hardware.

The use of this technology allows the manufacture of RF hardware to realize complex device structures with controlled cost. Additionally, RF, thermal and mechanical performance can be improved by using the additional freedom of design provided by the AM. It is anticipated that the AM will enable us to design for performance, to carry out mass optimization and to allow easy design changes. It would also reduce the cost for the design/manufacturing/assembly cycle, as well as provide an environmentally friendly alternative to conventional machining. AM is also viewed as a key enabling technology for the miniaturization of small complex systems. Besides the AM technology, other popular antenna solutions like antenna-in-package and antenna-on-chip will also be introduced. 


Course outline

The course will cover three topics. First, we will introduce the idea of co-designing passive and active devices to achieve an optimized system performance. Next, we will discuss the antenna-in-package (AiP) technology, which is widely used by the industry to fabricate millimeter wave (mm Wave) and THz devices.

Next, we will turn to the topic of additive manufacturing, aka 3D printing, for microwave devices and we will show, through case examples of a variety of antennas including lenses and reflectarrays, how the 3D printing technology for the fabrication of RF devices leads to a shorter turn-around time, lower cost, smaller carbon footprint and added flexibilities.  

Log in

Important Deadlines
12 February 2018
Platinum Sponsors



Gold sponsors


Silver sponsor

Bronze sponsor






European Microwave Association

APS logo name

ISAP logo