Antenna-in-Package (AiP) Technology for Millimetre-wave and 5G Applications

Organiser

Yueping Zhang, Nanyang Technological University, Singapore

Context

Antenna-in-package (AiP) technology that implements an antenna (or antennas) with a radio or radar die (or dies) into a standard surface-mounted device represents an important antenna technology achievement in recent years. AiP technology has been widely adopted by chip makers for 60-GHz radios and gesture radars. It is strongly believed that AiP technology will also provide elegant antenna solutions to 5G and beyond operating in the lower millimetre-wave bands.

An AiP should be designed together with the radio-frequency integrated circuit in the initial system architecture phase for optimum results. The fabrication of the AiP has always benefited from advanced packaging technologies such as low temperature co-fired ceramic (LTCC), embedded wafer level ball grid array (eWLB), and high-density interconnect (HDI) processes. Testing has to be considered along the whole manufacturing cycle. Probe-based measurement setups are suitable for AiP verification and characterization. Over-the-air (OTA) antenna measurements are required for production testing, integration and system level test.

This workshop gathers some of key AiP researchers and engineers together to exchange ideas to further advance the state-of-the-art of AiP technology as well as to provide an introduction to AiP technology and an in-depth coverage of AiP topics to participants.

Programme

1. An introduction to the development of AiP technology
2. AiP for 60-GHz radios with emphasis on antennas
3. AiP for 5G millimetre-wave micro base stations
4. AiP design for 5G millimetre-wave cellular devices
5. Application of the any-layer PCB technology for 5G antenna
6. QFN Based AiP solutions for millimetre-wave sensors
7. Antenna integration in packaging technology from 60 GHz up to 300 GHz
8. How to perform accurate millimetre-wave antenna measurements

Speakers

1. Yueping Zhang, Nanyang Technological University, Singapore
2. Quan Xue, South China University of Technology, City University of Hong Kong
3. Säily Jussi, VTT Technical Research Centre, Finland
4. Wonbin Hong, Pohang University of Science and Technology, Korea
5. Guy A. E. Vandenbosch, KU Leuven, Belgium
6. Thomas Zwick, Karlsruhe Institute of Technology, Germany
7. Frederic Gianesello, STMicroelectronics, France
8. Bart Smolders, Technische Universiteit Eindhoven, The Netherlands